Description
1 The machine utilizes independently developed infrared high-efficiency heating elements and employs advanced PID intelligent temperature control heating technology for precise temperature control.
2 It can heat leaded and lead-free PCB boards and components, especially suitable for PCB boards with BGA and SMD components.
3 The dedicated infrared heating has strong penetration, ensuring uniform heating of components without airflow, preventing displacement of tiny components on PCB boards, and guaranteeing soldering quality.
4 This machine is equipped with a 600W preheating (soldering) system with a preheating range of 120x120mm. It can be used in conjunction with the handheld infrared soldering machine T-835.
5 It is easy to operate and can be fully operated with simple training.
Parameter
Work floor size |
200x240mm |
Rated voltage and frequency |
AC220-230V/AC110V 60/50Hz |
Complete machine power |
500W |
Preheating chassis power |
450W |
Preheating chassis size |
120x120mm |
Preheating chassis temperature adjustable |
0-450°C |