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Description

1 The machine utilizes independently developed infrared high-efficiency heating elements and employs advanced PID intelligent temperature control heating technology for precise temperature control.

2 It can heat leaded and lead-free PCB boards and components, especially suitable for PCB boards with BGA and SMD components.

3 The dedicated infrared heating has strong penetration, ensuring uniform heating of components without airflow, preventing displacement of tiny components on PCB boards, and guaranteeing soldering quality.

4 This machine is equipped with a 600W preheating (soldering) system with a preheating range of 120x120mm. It can be used in conjunction with the handheld infrared soldering machine T-835.

5 It is easy to operate and can be fully operated with simple training.



Parameter

Work bench size 200x240mm
Rated voltage and frequency AC220-230V/AC110V 60/50Hz
Complete machine power 1600W
Preheating chassis power 1500W
Preheating chassis size 280x270mm
Preheating chassis temperature adjustable 0-450°C