Description
1 A large infrared soldering area,this increases the usage range of this machine drastically and makes it an economical investment.
2 Choice of different soldering cycles. Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
3 Special heat up and temperature equalization with all designs. Uses up to 3300 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
4 Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T937 to be easily bench positioned transported or stored.
5 Large number of available functions. The T937 can solder most boss-eyed or double-face PCB boards small parts, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
Parameter
| Parameter |
T-937 |
T-937M |
| Drawer Area |
306 mm×322mm |
350mm×400mm |
| Soldering Area (Lead-Free Welding) |
260mm×260mm |
290×375mm |
| Soldering Area (Lead Welding) |
300mm×310mm |
315mm×375mm |
| Dimension |
404mm×372mm×280mm |
473mm×466mm×290mm |
| Net Weight |
15.5kg |
20.7kg |
| Voltage/Frequency |
AC220-230V/50Hz,AC110V/60Hz |
AC220-230V/50Hz,AC110V/60Hz |
| Power Rating |
2300W |
3300W |
| Cycle Time |
2-16 minutes |
2-16 minutes |
| Temperature Range |
Room temperature - 350℃ |
Room temperature - 350℃< |