Description

1 A large infrared soldering area,this increases the usage range of this machine drastically and makes it an economical investment.

2 Choice of different soldering cycles. Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.

3 Special heat up and temperature equalization with all designs. Uses up to 3300 Watts of energy efficient Infrared heating and air circulation to re-flow solder.

4 Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T937 to be easily bench positioned transported or stored.

5 Large number of available functions. The T937 can solder most boss-eyed or double-face PCB boards small parts, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.

Parameter

Drawer Area	350 x 370(mm)
Soldering Area (Lead-Free Welding)	290 x 345(mm)
Soldering Area (Lead Welding)	315 x 345(mm)
Dimension	438 x 535 x 290(mm)
Net Weight	20.7 kg
Voltage/Frequency	AC220-230V/AC110V, 50Hz/60Hz
Power Rating	2960W
Cycle Time	2-16 minutes
Temperature Range	Room temperature - 300℃