Description

1 This product integrates functions such as reflow soldering, drying, insulation, shaping, rapid cooling, and constant temperature timing. It meets various soldering needs for SMD, BGA, and other components, completing soldering for all packaging forms such as CHIP, SOP, PLCC, QFP, and BGA on single or double-sided PCB boards. It can be used for product curing, circuit board thermal aging, PCB board repair, and other tasks.

2 This product adopts microcomputer control, automating the entire soldering process for easy operation.

3 This product utilizes rapid infrared radiation heating combined with cooling fans to ensure more accurate and uniform soldering temperatures.

4 This product stores 8 temperature parameter curves for selection and supports user-defined temperature parameter curve settings.

5 This product employs fuzzy temperature control technology and a visualized drawer-type workbench, making the entire soldering process visual.

5 This product features a maintenance-free, highly reliable design for peace of mind during use.

Parameter

智能回流焊机T-962A V2.0

Power supply	AC220V/50HZ；AC110V/60HZ
Rated power	1500W
Drawer panel area	300x320mm
Cycle Time	1～8 min
Size	375 x 450 x235 mm