Description

1 This product combines reflow soldering, drying, insulation, shaping, rapid cooling, and constant temperature timing functions into one, catering to various soldering needs such as SMD and BGA. It completes soldering for all packaging forms including CHIP, SOP, PLCC, QFP, and BGA on single or double-sided PCB boards. It can be used for product curing, circuit board thermal aging, PCB board repair, and more.

2 Controlled by a microcomputer, this product automates the entire soldering process, ensuring simplicity in operation.

3 Utilizing rapid infrared radiation heating combined with cooling fans to stir, this product achieves more accurate and uniform soldering temperatures.

4 With storage for 8 temperature parameter curves and support for user-defined temperature parameter curve settings, this product offers flexibility in temperature control.

5 Featuring fuzzy temperature control technology and a visualized drawer-type workbench, this product makes the entire soldering process visual.

6 Designed for maintenance-free operation and high reliability, this product provides peace of mind during use.

Parameter

Power supply	AC220V/50HZ；AC110V/60HZ
Rated power	800W
Drawer area	180 x 235mm
Cycle Time	1～8 min
Size	310 x 290 x170 mm
Cycle Time	1～8 min