Description
1 A large infrared soldering area,this increases the usage range of this machine drastically and makes it an economical investment.
2 Choice of different soldering cycles. Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
3 Special heat up and temperature equalization with all designs. Uses up to 3300 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
4 Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T963 to be easily bench positioned transported or stored.
5 Large number of available functions. The T963 can solder most boss-eyed or double-face PCB boards small parts, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
Parameter
Parameter Name |
Parameter Value |
Product Model |
T-963 |
Number of Heating Zones |
3 Upper / 3 Lower |
Heating Zone Length |
730mm |
Heating Method |
Infrared + Forced Hot Air |
Number of Cooling Zones |
1 |
Maximum PCB Width |
200mm |
Transport Direction |
Left → Right |
Conveyance Method |
Chain Drive + Chain Transmission |
PCB Heating Time |
100-600 seconds |
Power Supply |
220V 50/60Hz |
Rated Power |
4.5KW |
Average Power |
1.9KW |
Warm-up Time |
7-10 minutes |
Temperature Control Range |
Room Temperature ~ 350℃ |
Temperature Control Method |
PID Closed-loop Control |
Temperature Control Precision |
±1℃ (Temperature Instantaneous Fluctuation) |
PCB Temperature Distribution Deviation |
±2℃ (Only for Copper Circuit Boards) |
Physical Dimensions (Length x Width x Height) |
1200mm × 490mm × 527mm |
Machine Weight |
88.2KG |