Description

1 The machine adopts a handheld lamp body structure, which is flexible to operate and easy to control, suitable for the desoldering and removal of flat components at any angle, especially BGA and SMD components.

2 Special infrared heating with strong penetration capability ensures uniform heating of components, breaking through the traditional drawback of covering components with a hot air desoldering machine hood, avoiding significant thermal shock.

3 Infrared heating without airflow does not affect surrounding tiny components, suitable for desoldering or reworking BGA, SMD, CSP, LGA, QFP, PLCC, and BGA with solder balls, especially BGA and SMD components. When used with the infrared preheating station T-8120, it can rework various types of socket strips and pin sockets (such as CPU sockets and GAP plug-in strips).

4 Easy to operate, fully operable after one day of training. No need for desoldering fixtures; the machine can desolder all flat soldered components.

5 Fully meets the desoldering/rework requirements of BGA components in mobile phones, computers, laptops, gaming devices, etc.

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