Description

1 It utilize independently developed infrared desoldering technology.

2 Dedicated infrared heating with strong penetration ensures uniform heating of components, overcoming the traditional drawback of hot air desoldering machines covering components for heating, which leads to significant thermal impact.

3 Easy operation; one day of training is sufficient for full proficiency with the machine.

No need for desoldering fixtures; the machine can desolder all components within the range of 15-35mm.

4 Equipped with a 600W preheating soldering system, with a preheating range of 120x120mm.

5 Infrared heating without airflow does not affect surrounding micro-components and can be applied to all types of components, especially BGA and SMD components.

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