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Description

1 Specialized infrared heating ensures strong penetration and uniform heating of components, overcoming the significant drawback of traditional hot air desoldering machines that enclose components for heating, causing greater thermal shock.

2 Easy operation; full proficiency can be achieved after one day of training.

3 No need for desoldering fixtures; the machine can desolder all components ranging from 15x15mm to 25x25mm.

4 Equipped with a 350W preheating soldering system with a preheating range of 120x80mm.

5 Infrared heating with no airflow prevents the disruption of surrounding tiny components, making it suitable for all components, especially Micro BGA components.

6 Utilizing independently developed infrared desoldering technology



Parameter

Working Voltage AC220v/AC110v/50-60Hz
Output power 600W
Infra-red lamp body temperature adjustable 100-350℃
Preheating dish temperature adjustable 60-200℃