Description
1 Specialized infrared heating ensures strong penetration and uniform heating of components, overcoming the significant drawback of traditional hot air desoldering machines that enclose components for heating, causing greater thermal shock.
2 Easy operation; full proficiency can be achieved after one day of training.
3 No need for desoldering fixtures; the machine can desolder all components ranging from 15x15mm to 25x25mm.
4 Equipped with a 350W preheating soldering system with a preheating range of 120x80mm.
5 Infrared heating with no airflow prevents the disruption of surrounding tiny components, making it suitable for all components, especially Micro BGA components.
6 Utilizing independently developed infrared desoldering technology
Parameter
Working Voltage |
AC220v/AC110v/50-60Hz |
Output power |
600W |
Infra-red lamp body temperature adjustable |
100-350℃ |
Preheating dish temperature adjustable |
60-200℃ |