Description

1 The machine utilizes independently developed infrared heating devices and internationally advanced infrared dismantling technology.

2 Specialized infrared heating with strong penetration and uniform heating of components, overcoming the traditional hot air rework station's disadvantage of covering components for heating, which leads to significant heat impact.

3 Easy operation, fully operable after a day of training.

4 No need for dismantling fixtures; the machine can dismantle all components within the range of 35-50mm.

5 Equipped with an 800W preheating soldering system, with a preheating range of 240x180mm.

6 Infrared heating without hot air flow, which does not affect surrounding small components. It can dismantle or rework BGA, SMD, CSP, LGA, QFP, PLCC, and BGA ball planting, especially BGA and SMD components. It can also rework various connector strips and pin-type sockets (such as CPU sockets and GAP connector strips).

7 Fully meets the requirements for BGA dismantling/rework for computers, laptops, and electronic gaming devices. Particularly suitable for computer north and south bridge components.

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