Description

1. Powerful and comprehensive function selection, with eight memory temperature curves. Users can freely select heating curves according to dismantling and soldering requirements.

2. Intelligent curve heating allows automatic completion of the entire dismantling and soldering process according to your preset temperature curve, making the entire process more scientific.

3. Three-dimensional adjustable lamp body, with a retractable slide system suitable for dismantling components at any angle. The infrared lamp body is equipped with laser positioning for easier adjustment and more accurate positioning.

4. PID intelligent temperature control technology ensures more precise temperature control and perfect curves, effectively avoiding rapid or uninterrupted heating that may damage chips or circuit boards.

5. Ultra-high-power preheating and melting glue system, equipped with independently developed infrared heating devices for strong penetration, uniform heating of components, and more accurate temperature control. Capable of dismantling or reworking BGA, SMD, CSP, LGA, QFP, PLCC, and BGA ball planting, various types of connector strips, and pin-type sockets (such as CPU sockets and GAP connector strips). Fully meets the requirements of BGA dismantling/rework for computers, laptops, and electronic gaming devices, particularly suitable for computer north and south bridge dismantling.

6. User-friendly human-machine interface with perfect LCD display, providing clear insight into the entire heating process.

7. Sturdy appearance, compact size, embodying technology throughout. Desktop placement mode provides more space. Simple operating instructions make it easy for you to understand and use.

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