Description

1 Built-in with 8 soldering curves, meeting the demands of rapid operations.

2 Automatically completes heating curves, ensuring both accuracy and scientific precision.

3 Three-dimensional adjustable lamp body, retractable slide frame system, suitable for desoldering components at any angle. The infrared lamp body is equipped with laser positioning.

4 PID intelligent temperature control technology ensures more precise temperature control and perfect curves, effectively avoiding damage to chips or circuit boards caused by rapid or uninterrupted heating.

5 Featuring a high-power preheating adhesive system and independently developed infrared heating elements, it offers strong penetration, uniform heating of components, and precise temperature control. It enables desoldering or rework of various components including BGA, SMD, CSP, LGA, QFP, PLCC, and BGA planting ball, as well as various socket types like CPU sockets and GAP sockets, fully meeting the requirements for BGA desoldering/rework in computers, laptops, and gaming devices.

6 Human-machine operation interface with LCD display for intuitive operation.

7 Portable size.

Parameter